BGA散热片，板端散热片

信诺华工业提供多种工业散热解决方案-譬如如下这些典型产品分类：
BGA散热片
BGA散热器之所以如此命名，是因为它们安装在BGA设备上，但实际上只是简单的挤出件。BGA散热器通常是按需切割的，从而使其能够用于更多样化的应用。横切的数量和大小取决于环境。因为BGA散热器通常很小，所以散热器的连接和固定是一个挑战。根据应用和机械要求，散热器可以连接到设备或PCB。

板端散热片
板端散热片之所以如此命名，是因为它们通常连接到设备和PCB上。这些散热器通常构造为冲压或挤出，设计用于常见的封装尺寸，如T0220、T0247和D2pak。冲压散热器可以具有夹在设备上的功能，因此不需要螺钉或额外辅助安装零件。冲压散热片具有弯曲/扭曲的散热片，以提高自然对流或强对流中的散热性能。铝冲压件经过阳极氧化处理，可在自然对流中提高性能。如果要将散热器安装到PCB上，则可以将可焊接的接线片或引脚连接到散热片上。

LED散热片

LED应用由于其小尺寸、高功耗、复杂的环境和成本限制而具有散热挑战性。LED尺寸较小，可以聚集在一起产生更多/更亮的光。它们的小尺寸意味着热量从LED扩散到散热器中是极其重要的。

散热片的安装和固定

通过将这些散热片粘在电路板、半导体、继电器和其他热敏电气元件上来去除多余的热量。
散热片的常用固定方式包含粘贴安装和螺丝铆钉安装等。
粘贴安装胶带还简化了安装流程，因为你不需要额外的紧固件或等待环氧树脂固化。

信诺华工业提供最广泛的制造工艺，确保您获得最具成本效益的散热设计。

>压铸散热片

>精密加工散热片（CNC）

>挤出工艺散热片

>折弯工艺散热片

信诺华工业核心能力
提供散热片从概念原型和小批预生产的快速实现和交付，以支持更短的设计周期和项目上市。通过过去服务于电子加工制造和EMS行业的巨头，我们累计了50多个开发定制散热片的成功案例，积累了丰富的经验。种类包含。善于将AAVID,Wakefield,Fischer Elektronik等各类进口散热片--比如压铸散热片,精密加工散热片（CNC）,挤出工艺散热片,折弯工艺散热片等国产化。

总之，我们提供散热片和热解决方案组件的设计方案。

我们提供端到端的支持、散热方案设计制造、质量和服务。

>设计灵活性

>成本效益制造

>工程支持

>质量控制

VARIOUS TYPES OF HEATSINKS

BGA HEATSINKS
BGA heat sinks are named as such because they are mounted to BGA devices, but are actually just simple extrusions. BGA heat sinks are usually crosscut to convert the extruded fins into pins which allow them to be used in more diverse applications. The number and size of the crosscuts are dependent upon the environment. Because BGA heat sinks are generally small, the attachment of the heat sink is a challenge. The heat sinks can be either attached to the device or to the PCB depending upon the application and the mechanical requirements.

BOARD LEVEL HEATSINKS
Board Level heat sinks are named as such because they are generally attached both to the device and the PCB. Usually constructed as either a stamping or an extrusion, these heat sinks are designed for common package sizes like T0220, T0247, and D2pak. Stamped heat sinks can have features that clip on to the device so that a screw or secondary clip is not required. Stamped heat sinks have bent/twisted fins to improve the thermal performance in either natural or forced convection. Aluminum stampings are anodized for improved performance in natural convection. If the heat sink is to be mounted to the PCB, then a solderable tab or pin can be attached to the heat sink.

LED HEATSINKS
LED applications are thermally challenging because of their small size, high power dissipation, complex environment, and cost restrictions. LEDs are small in size and can be clustered together to produce more/brighter light. Their small size means that the spreading of the heat from the LED into the heat sink is extremely important. To improve the spreading, many LEDs are mounted to metal-clad PCBs. While LEDs are electrically efficient, they are only about 30% efficient from a thermal perspective, which leads to thermal challenges.

Sinohua Core Competencies  
We provide end-to-end support, thermal design manufacturing, quality, and services.

> Design Flexibility
> Cost Effective Manufacturing
> Engineering Support
> Quality Control
> Supply Chain Management
> Global Support

Quick turn-around of prototypes and pre-production quantities to support short design cycles.

Provide design proposal of heat sinks and thermal solution assemblies.